Magnetically Affected Texture and Microstructure Evolution during Grain Growth in Zirconium
نویسندگان
چکیده
منابع مشابه
Microstructure evolution and abnormal grain growth during copper wafer bonding
Evolution of microstructure morphologies and grain orientations of Cu-Cu bonded wafers during bonding and annealing were studied by means of transmission electron microscopy, electron diffraction and X-ray diffraction. The bonded Cu grain structure reaches steady state after post-bonding anneal. An abnormal (220) grain growth was observed during the initial bonding process. Upon annealing, the ...
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متن کاملEvolution of Texture and Grain Size during Equal Channel Angular Extrusion of Pure Copper and 6012 Aluminum
Among different SPD techniques, Equal channel Angular Pressing has attracted the most attentions, because of applying large strain to solid bulk materials. In this research, ECAP process up to 6 passes was carried out on a pure copper and a 6012 Al-Mg-Si alloy with BC route in ECAP dies with Φ=120 and Ψ=20 and diameter of 20and 10 millimeter respectively. Moreover, X-ray diffraction (XRD) syste...
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ژورنال
عنوان ژورنال: Materials Science Forum
سال: 2012
ISSN: 1662-9752
DOI: 10.4028/www.scientific.net/msf.715-716.946